Item

Parameter

Layer

1-12 layer

Type of dielectric material

FR4

Board thickness

0.2-5.0mm(8-200mil)

PTH hole copper thickness

1/2oz-3oz

Process size

2mm-2m

 Line width/Space(min)

0.1mm(4mil)

Min drilling diameter

0.2mm(10mil)

Min Punch diameter

0.9mm(35mil)

 Tolerance

 Hole position

+0.075mm(3mil)

 Line width

+0.05mm(2mil)

 Hole diameter

PTH +0.075mm(3mil)

NPTH+0.05mm(2mil)

 Routing dimension tolerance

（edge to edge）

Routing:+0.15mm(6mil)

 Punching:+0.10(4mil)

 Bow & Twist

0.7%-1%

Surface treating

technic of pad

Nickel/Gold plating/Entek/Hot Air Level

Insulation Resistance

10KΩ-20MΩ

Etching Tolerance

+1mil(25um)

Testing voltage

300V

V-cut

panel size

110*100mm-660*600mm

 Board thickness

≥0.6mm(24mil)

Tolerance

+0.1mm(4mil)

 Drilled slot width

≤0.5mm(20mil)

Angle

30°，45°，60°，90°

 Tolerance of drilled slot

（slot size tol≥2W）

PTHL:+0.15mm(6mil)

W:+0.1mm(4mil)

NPTHL:+0.125(5mil)

W:+0.1mm(4mil)

 Registration Tolerance of Front/Back image

0.075mm(4mil)

Tolerance of innerlayer to innerlayer

4layers: ≤0.15mm(6mil)

6layers: ≤0.025mm(10mil)

Registration of interlayer

+3mil(76um)

to interlayer

Multilayer PCB

Tolerance of board thickness

4layers:+0.13mm(5mil)

6layers:+ 0.15mm(6mil)

Impedance

60ohm+10%

  Item

 Test condition

Index

JB-01

JB-02

JB-03

Thermal Conductivity(W/m.k)

A

 1.0~1.2

 1.5~2.0

 2.0~2.5

 Peel Strength(N/mm)

A

After thermal stress

 ≥1.8

 ≥1.8

  ≥1.8

Blister test After Thermal stress

A

After thermal impact

  260℃  2min

 288℃ 2min

 300℃ 2min

Flammability

UL94

 V-0

 V-0

 V-0

Thermal resistance max((℃/W)

A

 ≤1.2

 ≤1.0

≤0.75

Surface Resistance(MΩ.m)

A

Constant humidity treatment

(90%, 35 ℃,96H)

 ≥1×105

 ≥1×105

 ≥1×106

Volume Resistivity(MΩ.m)

A (90%,35 ℃,96H)

 ≥1.8×106

 ≥1.8×106

 ≥1.8×107

Min Dielectric Breakdown(KV)

A

 ≥2.0

 ≥2.5

 ≥3.0

Dielectic Constant(1MHz)

(40 ℃,90%,96H)

 ≤4.4

 ≤3

 ≤2.5

Dissipation Factor

(40 ℃,90%,96H)

 ≤0.03

 ≤0.03

 ≤0.03