Demand for any-layer HDI boards has strengthened, encouraging PCB suppliers to scale up their purchases of new equipment for capacity expansions. However, delivery lead times for laser drills, the key pieces of equipment in this field, have extended to as long as six months, according to industry sources.

          Suppliers are also facing challenges relating to production yields, as developing the high-end boards with complicated circuit designs requires upgrades to their manufacturing processes, the sources indicated.

          The above-mentioned issues potentially could affect supplies of any-layer HDI boards later in 2010, and lead to undersupply in 2011, the sources expressed concerns.

          Any-layer HDI PCBs are seeing growing adoption among smartphones. Vendors including Apple, HTC, LG Electronics and Sony Ericsson have all adopted any-layer HDI boards in their products.